Medicept Bond Plus Nt

Description

Medicept BondPlus NT is an advanced total-etch, single-component adhesive system designed for effective bonding in dental restorations. This innovative product incorporates a unique technology that provides exceptional protection against microleakage, ensuring long-lasting and reliable results.

One of the key features of BondPlus NT is its 15% filling with 0.4 micron barium glass, which is also found in the renowned Medicept Flash composite. This filling material not only reinforces the hybrid zone but also penetrates the dentin tubules, creating a true “structural bond” that surpasses unfilled or even “nano” filled adhesive systems. This structural bond enhances the overall strength and durability of the restoration, contributing to its longevity.

Key Specification 

• Shear Bond Strength: 16.4Mpa
• Micro-Tensile Bond Strength To Dentine: 25MPa
• Micro-Tensile Bond Strength To Dnamel: 31MPa
• Marginal Seal To Enamel: 100%
• Marginal Seal To Dentine: 99%

Packaging 

• 1 X 5ml bottle

Direction To Use 

• Prepare the tooth surface according to standard clinical procedures, ensuring proper cleaning and etching if necessary.
• Shake the BondPlus NT bottle well to ensure proper mixing of the components.
• Apply a thin, even layer of BondPlus NT onto the prepared tooth surface using a micro brush or applicator, ensuring complete coverage.
• Agitate the adhesive gently for approximately 20 seconds to allow for thorough penetration and wetting of the surface.
• Use a gentle stream of air or an oil-free air syringe to evaporate the solvent.
• Light-cure the adhesive layer for the recommended time 20sec using a curing ligh.
• Proceed with the placement of the desired restorative material, whether it’s a composite, compomer, or direct restoration.
• Continue with the restorative procedure according to standard protocols.
• Clean the instruments and surfaces thoroughly to remove any residual adhesive.
• Recap the BondPlus NT bottle tightly to prevent evaporation or contamination.